Light emitting diode package substrate



FIG. 1 is a perspective view of a first embodiment of a light emittingdiode package substrate showing our new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a left side view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is top view thereof;

FIG. 7 is a bottom view thereof;

FIG. 8 is a perspective view thereof with a light emitting diode chipmounted;

FIG. 9 is a perspective view of a second embodiment thereof;

FIG. 10 is a front view thereof;

FIG. 11 is a rear view thereof;

FIG. 12 is a left side view thereof;

FIG. 13 is a right side view thereof;

FIG. 14 is top view thereof;

FIG. 15 is a bottom view thereof;

FIG. 16 is a perspective view thereof with light emitting diode chipsmounted;

FIG. 17 is a perspective view of a third embodiment thereof;

FIG. 18 is a front view thereof;

FIG. 19 is a rear view thereof;

FIG. 20 is a left side view thereof;

FIG. 21 is a right side view thereof;

FIG. 22 is top view thereof;

FIG. 23 is a bottom view thereof; and,

FIG. 24 is a perspective view thereof with light emitting diode chipsmounted.

The broken lines are for the purpose of illustrating portions of thelight emitting diode package substrate and the light emitting diodechips and form no part of the claimed design. The light shade lines onthe surface portions indicate contour and not surface decoration.

CLAIM The ornamental design for a light emitting diode packagesubstrate, as shown and described.